Epoxy Material Solutions

Electronic Component Bonding

Recommended Material	Product Grade	Main Features
One‑component Medium‑temperature Curing Epoxy Bonding Adhesive	EP‑2000C	Suitable for bonding protection of electronic components and bonding process on production lines
High‑temperature Resistant Fast‑curing Epoxy Adhesive	F‑5130 F‑5140	Suitable for structural bonding and potting under high‑temperature conditions for machinery and electronic components. Features anti‑vibration, impact resistance, high toughness, excellent mechanical and electrical properties

Motor / Motor Magnetic Steel Bonding

Recommended Material	Product Grade	Main Features
One‑component Fast‑curing High‑strength Epoxy Adhesive	LX‑311CB LX‑311HE LX‑401	Suitable for bonding of metal, glass, ceramic, hard rubber, cement, plastic, wood and other materials

Motor Blade Bonding & Repair

Recommended Material	Product Grade	Main Features
Two‑component Heat‑resistant High‑strength Epoxy Adhesive	F‑5247 F‑5248	Suitable for bonding and repair of wear‑resistant ceramic sheets on motor blade steel plates

IGBT Potting

Recommended Material	Product Grade	Main Features
Two‑component Epoxy Electrical Insulation Potting Material	TH‑850(FB)	Room‑temperature curing potting compound with insulation, moisture‑proof and shock‑resistant properties. Long‑term service temperature: ‑50 °C ~ 100 °C
Flux for Electronic Assembly	PCF‑6A	Low solid content, halogen‑free, no‑clean flux with non‑rosin type

Bonding of Similar / Dissimilar Materials

Recommended Material	Product Grade	Main Features
Room‑temperature Curing Epoxy Adhesive	DG‑3SDG‑3N	Suitable for bonding similar or dissimilar materials including metal, glass, ceramic, hard rubber, cement, plastic and wood. It can also be used for insulation, moisture‑proof and shock‑proof potting of electronic components.