IGBT Potting

Two‑component Addition‑curing Silicone Gel GRESIL® R‑895

Main Features: Suitable for IGBT potting, encapsulation, casting and sealing, providing protection for electronic components and assemblies.

表格

ItemTest ConditionUnitTypical Property
AppearancePart A: Transparent fluid
Part B: Transparent fluid
Mixing RatioMass RatioA:B = 1:1
Mixed ViscosityGB/T 2794‑2013mPa·s850
Pot Life25 °Ch1~1.5
Curing Time80 °Cmin20
DensityGB/T 533‑2008g/cm³0.98
PenetrationGB/T 269‑1991200~300
Dielectric Breakdown StrengthGB/T 1695‑2005kV/mm15
Volume ResistivityGB/T 1692‑2008Ω·cm1.0×10¹⁴
Dielectric ConstantGB/T 1693‑20071MHz2.8