Basic silicone materials
Transparent potting compound
Liquid Silicone Rubber
Liquid Silicone Rubber
Transparent potting compound
Features
◇ Very clear;
◇ Excellent fluidity;
◇ Non-corrosive to metals;
◇ Excellent electrical insulation and sealing performance;
◇ Low strength, easy to strip and repair;
Typical Applications
◇ Potting of communication cable joints;
◇ Insulating potting of other electronic and electrical components;
Typical Properties
| Item | Unit | Value | ||||
| GMX-6106 | GMX-8103 | GMX-BT | ||||
| Before Curing | Appearance | A | Colorless transparent | Colorless transparent | Colorless transparent | |
| B | Colorless transparent | Colorless transparent | Colorless transparent | |||
| Specific Gravity, 23℃ | A | g/cm³ | 0.97 | 0.98 | ||
| B | 0.97 | 0.98 | ||||
| Viscosity, after stirring at 23℃ | A | Pa.s | 1~3 | 0.5~1.2 | 1~1.5 | |
| B | 1~2 | 1~1.5 | ||||
| Mixing Ratio | A:B | 100:5 | 1:1 | 1:1 | ||
| Pot Life, 25℃ | h | 1 | 2~3 | 10 | ||
| After Curing | Dielectric Strength | MV/m | 15 | 15 | 15 | |
| Volume Resistivity | Ω.cm | 1×10¹³ | 1×10¹⁴ | 1×10¹³ | ||
| Dielectric Constant, 1MHz | 2.7 | 2.6 | 2.6 | |||
| Shore A Hardness | 10~20 | |||||
| Operating Temperature | ℃ | -50~250 | ||||
| Dielectric Loss, 1MHz | 0.00012 | 0.001 | ||||
Instructions for Use
◇ Weighing: Weigh the compound according to the mixing ratio and thoroughly mix the two components, preferably using dedicated mixing equipment (such as a small planetary mixer). When mixing by hand, be careful to scrape the bottom and side walls of the mixing container.
◇ Degassing: Degas under vacuum in dedicated mixing equipment. Alternatively, place the mixed compound together with its container in a vacuum degassing device and degas under vacuum. During vacuum degassing, the liquid level of the mixture may rise to 3-4 times the original volume before the bubbles automatically collapse. After the bubbles have collapsed, maintain the vacuum for 4-6 minutes, then release the vacuum.
◇ Potting: The thoroughly mixed silicone rubber can be poured directly into the cavity of the component to be encapsulated. Care should be taken to minimize the entrainment of air. If feasible, the compound should be poured under vacuum conditions, especially when the encapsulated or potted component has large voids or small gaps. If this process cannot be used, vacuum treatment should be performed after the compound is poured in.
Product inquiry
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