Basic silicone materials
Thermally conductive insulating potting compound GMX-8152 series
Liquid Silicone Rubber
Liquid Silicone Rubber
Thermally conductive insulating potting compound GMX-8152 series
Features
◇ Flame retardant, UL94 certified;
◇ Room temperature curing; heating significantly increases the curing speed;
◇ Thermally conductive insulating medium;
◇ Non-corrosive to metals;
Typical Applications
◇ Suitable for potting power modules;
◇ Protection of electronic components and assemblies;
◇ Used for potting, casting, and sealing;
Typical Properties
| Item | Unit | Value | ||||||||
| 8152/04 | 8152/06 | 8152/08 | 8152/11 | 8152/11H05Low Hardness | 8152/15 | 8152/18 | ||||
| Before Curing | Appearance | A | Black paste | Black paste | Black paste | Black paste | Dark gray paste | Black/white paste | Black/white paste | |
| B | White paste | White paste | White paste | White paste | Dark gray paste | White paste | White paste | |||
| Viscosity, stirred at 23℃ | A | Pa.s | 1.5~3 | 3~5 | 10~14 | 5~10 | 4~5 | 30~50 | 30~45 | |
| B | 1.5~3 | 2~4 | 4~8 | 5~10 | 5~6 | 30~40 | 30~45 | |||
| A/B | 2~3 | 3~5 | 8~10 | 5~10 | 4~5 | 25~40 | 30~45 | |||
| Mixing Ratio | A:B | 1:1 | ||||||||
| Pot Life | H | 1~2 | ||||||||
| After Curing | Dielectric Strength | MV/m | 18 | 18 | 18 | 18 | 17 | 18 | 18 | |
| Dielectric Constant, 1MHz | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |||
| Dielectric Loss, 1MHz | 0.01 | 0.01 | 0.01 | 0.01 | 0.01 | 0.01 | 0.01 | |||
| Volume Resistivity | Ω.cm | 1.0×10¹³ | 1.0×10¹³ | 1.0×10¹³ | 1.0×10¹³ | 1.0×10¹³ | 1.0×10¹³ | 1.0×10¹³ | ||
| Shore A Hardness | 45±5 | 50±5 | 60±5 | 50±5 | 60±5 | |||||
| Shore 00 Hardness | 62~70 | 62~70 | ||||||||
| Flame Retardancy | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |||
| Oxygen Index | % | 37 | 43 | 47 | ||||||
| Thermal Conductivity | W/m.K | 0.4 | 0.6 | 0.8 | 1.2 | 1.2 | 1.5 | 1.8 | ||
Instructions for Use
Preparation: Before use, be sure to stir each of components A and B thoroughly up and down. The area to be potted should preferably be wiped clean with anhydrous ethanol, acetone, or other solvents.
Weighing: Weigh components A and B at a weight ratio of 1:1.
Mixing: Thoroughly mix the two components, preferably using dedicated mixing equipment (such as a small planetary mixer). When mixing by hand, be careful to scrape the bottom and side walls of the mixing container.
Degassing: Degas under vacuum in dedicated mixing equipment. Alternatively, place the mixed compound together with its container in a vacuum degassing device and degas under vacuum. During vacuum degassing, the liquid level of the mixture may rise to 3-4 times the original volume before the bubbles automatically collapse. After the bubbles have collapsed, maintain the vacuum for 4-6 minutes, then release the vacuum.
Potting and Curing: Pour the prepared compound into the area to be potted. Allow it to stand at room temperature for natural curing, or heat it to accelerate curing.
Product inquiry
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