Self-adhesive addition-curing potting silicone rubber GMX-8109

Features

◇ Excellent fluidity;

◇ Self-adhesive, no primer required;

◇ Can be peeled apart, easy to repair;

◇ Non-corrosive to metals;

Typical Applications

◇ Potting of medium and high voltage circuit breaker pole columns;

◇ Encapsulation, casting, or sealing of power devices;

◇ Protection of electronic components and assemblies;

◇ Communication cable joints and precision components;

Typical Properties

Instructions for Use

◇ Weighing: Weigh components A and B at a weight ratio of 1:1.

◇ Mixing: Thoroughly mix the two components, preferably using dedicated mixing equipment (such as a small planetary mixer). When mixing by hand, be careful to scrape the bottom and side walls of the mixed compound.

◇ Degassing: Degas under vacuum in dedicated mixing equipment. Alternatively, place the mixed compound together with its container in a vacuum degassing device and degas under vacuum. During vacuum degassing, the liquid level of the mixture may rise to 3-4 times the original volume before the bubbles automatically collapse. After the bubbles have collapsed, maintain the vacuum for 4-6 minutes, then release the vacuum.

◇ Potting: The thoroughly mixed GMX-8109 potting silicone rubber can be poured directly into the cavity of the component to be encapsulated. Care should be taken to minimize the entrainment of air. If feasible, the compound should be poured under vacuum conditions, especially when the encapsulated or potted component has large voids or small gaps. If this process cannot be used, vacuum treatment should be performed after the compound is poured in. This product has a certain self-degassing function. When the potted component has a relatively simple structure and is not thick (less than 1cm) and the influence of a small number of bubbles can be ignored, the vacuum degassing process can be omitted and the standing degassing method can be used to simplify the process.

◇ Curing: The standard curing condition is heat curing at 100℃×4h. For larger components, appropriately extending the heating time has a beneficial effect on both the electrical properties and adhesion of the compound.