Basic silicone materials
High-performance silicone thermally conductive potting compound
Liquid Silicone Rubber
Liquid Silicone Rubber
High-performance silicone thermally conductive potting compound
Features
◇ Low viscosity, self-degassing
◇ Self-adhesive
◇ Electromagnetic compatibility
◇ High thermal conductivity
◇ Excellent anti-settling performance
Typical Applications
◇ Suitable for potting power modules
◇ Protection of electronic components and assemblies
◇ Used for potting, casting, and sealing
Typical Properties
| Item | Unit | Model | ||||||
| 8152/8760 | 8152/8760Z | 8152/08M | 8152/18 | 8152/22 | ||||
| Before Curing | Appearance | A | Black paste | Black paste | Black paste | White paste | White paste | |
| B | Gray-white paste | Gray-white paste | Gray-white paste | Black paste | Dark gray paste | |||
| Viscosity, stirred | A | Pa.s | 1~2 | 1~2 | 1~2.5 | 30~45 | 30~50 | |
| B | 3~4 | 3~4 | 1~2.5 | 30~45 | 30~50 | |||
| A/B | 2~3 | 2~3 | 1~2 | 30~45 | 30~50 | |||
| Mixing Ratio | A:B | 1:1 | ||||||
| Pot Life | h | 2 | 2 | 2 | 1~2 | 1~2 | ||
| After Curing | Dielectric Strength | MV/m | ≥15 | |||||
| Dielectric Constant, 1MHz | ≤4 | |||||||
| Dielectric Loss, 1MHz | 0.01 | |||||||
| Volume Resistivity | Ω.cm | 1.0×10¹³ | ||||||
| Shore A Hardness | 50 | 35 | 55 | |||||
| Shore 00 Hardness | 62~70 | 62~70 | ||||||
| Density | g/cm³ | 1.5 | 1.5 | 1.6 | 2.7 | 2.8 | ||
| Volume Expansion Rate | 1/℃(0~) | ≤4.0×10⁻⁴ | ≤4.0×10⁻⁴ | ≤4.0×10⁻⁴ | ≤4.0×10⁻⁴ | ≤4.0×10⁻⁴ | ||
| Water Absorption | % | ≤0.1 | ≤0.1 | ≤0.1 | ≤0.1 | ≤0.1 | ||
| Flame Retardancy | UL94 | V-0 | V-0 | V-0 | V-0 | V-0 | ||
| Thermal Conductivity | W/m.K | 0.6 | 0.6 | 0.8 | 1.8 | 2.2 | ||
| Product Features | General Purpose | Self-Adhesive | Electromagnetic Compatibility | High Thermal Conductivity | High Thermal Conductivity | |||
Instructions for Use
◇ Preparation: Before use, be sure to first stir each of compounds A and B thoroughly up and down. The area to be potted should preferably be wiped clean with anhydrous ethanol, acetone, or other solvents.
◇ Weighing: Weigh components A and B at a weight ratio of 1:1.
◇ Mixing: Thoroughly mix the two components, preferably using dedicated mixing equipment (such as a small planetary mixer). When mixing by hand, be careful to scrape the bottom and side walls of the mixing container.
◇ Degassing: Degas under vacuum in dedicated mixing equipment. Alternatively, place the mixed compound together with its container in a vacuum degassing device and degas under vacuum. During vacuum degassing, the liquid level of the mixture may rise to 3-4 times the original volume before the bubbles automatically collapse. After the bubbles have collapsed, maintain the vacuum for 4-6 minutes, then release the vacuum.
◇ Potting and Curing: Pour the prepared compound into the area to be potted. Allow it to stand at room temperature for natural curing, or heat it to accelerate curing.
Product inquiry
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