Thermal & adhesives
BONDING AND SEALING
Electronic Adhesives and Supporting Materials
07
Electronic Adhesives and Supporting Materials
BONDING AND SEALING
Component Fixing
| Overview | Product Grade | Product Features | |
|---|---|---|---|
| Silicone Adhesives | One-component, room-temperature curingNeutral alkoxy type, non-corrosive to substratesGood electrical insulation | GRESIL® | Thixotropic paste with excellent adhesion |
| GRESIL® | Flame-retardant white adhesive, UL94 V-0 | ||
| GRESIL® | Translucent, flowable, high strength, conformal coating | ||
| GRESIL® | Flame-retardant white adhesive, UL94 V-0 | ||
| GRESIL® | High strength, high elongation at break | ||
| Epoxy Adhesives | 1-2:1 two-component, room-temperature curing | DG-3S | Good media resistance (resistant to oil, water, acid and alkali)Good toughness, low stress, excellent overall performance |
| 2:1 two-component, room-temperature curing | DG-3N | ||
| 10:1 two-component, room-temperature curing | F-5247 | Good toughness, low stress, resistant to high and low temperatures, excellent electrical and mechanical properties, | |
| F-5248 | |||
| One-component, medium-temperature curing at 120°C/30 min | EP-2000C | Good thixotropy, no sagging on vertical surfaces | |
| One-component, low-temperature curing at 80°C/30 min | LX-311CB | Good thixotropy; can bond metal, glass, ceramics, hard rubber, cement, plastics, wood and other materials | |
| LX-311TS | |||
| LX-401 |
Overview
These products feature excellent adhesion and resistance to high and low temperatures, can be used long-term at -60 to 200°C, and provide excellent dust, moisture and shock resistance as well as insulation.
Widely used for bonding and sealing of electronic components and electronic/electrical equipment.
Electronic Encapsulation
| Product Grade | Product Features | Typical Applications | |
|---|---|---|---|
| Silicone Rubber | GRESIL® | One-component thermoset, high insulation strength | Suitable for silicon rectifier encapsulationProvides insulation, moisture and shock resistance |
| GRESIL® | Neutral, non-corrosive, self-leveling | ||
| GRESIL® | One-component, easy to handle | Specially for high-performance flip-chip encapsulation materials | |
| GRESIL® | Suitable for heat dissipation of electronic components such as solid-state drives, network servers and high-power LED lighting |
Photovoltaic Industry
| Product Grade | Product Features | Typical Applications | |
|---|---|---|---|
| Silicone Rubber | GRESIL® | Acetoxy type, translucent, high strength, high adhesion | Suitable for bonding and sealing of photovoltaic module frames, junction boxes, etc., providing waterproof, insulating and shock-resistant protection for PV panels |
| GRESIL® | Neutral, non-corrosive to substrates | ||
| GRESIL® | Two-component, fast curing |
OA Equipment and Sensors
| Product Grade | Product Features | Typical Applications | |
|---|---|---|---|
| Silicone Rubber | GRESIL® | Low cyclic siloxane content (D3-D10<300ppm)Acetone-eliminating type, high strength, high adhesion | Suitable for bonding and sealing of electronic components in OA office equipment, ensuring stable operation of printers |
| GRESIL® | Self-leveling | Suitable for coating and bonding of sensors, protecting sensor circuit boards |
Product inquiry
Send the model code and we will confirm the details.
Quote the series above together with the quantity, application and required material behavior.