Application map
Epoxy Conductive Adhesive Film
Application environment, system, component and the documented material solution behind it.
05
Electronic Adhesives and Supporting Materials
Epoxy Conductive Adhesive Film
System / equipmentEpoxy Conductive Adhesive Film
Stated application scope
- Circuit board materials; metal backplanes and heat sinks; fluoropolymer circuits; ceramic circuits; copper, brass, alloys and aluminum
Related material solutions
Epoxy conductive adhesive film
KPF-EC (silver-filled epoxy film, thickness 50 to 200 μm)
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