Application map

Epoxy Conductive Adhesive Film

Application environment, system, component and the documented material solution behind it.

05

Electronic Adhesives and Supporting Materials

Epoxy Conductive Adhesive Film

System / equipmentEpoxy Conductive Adhesive Film

Stated application scope

  • Circuit board materials; metal backplanes and heat sinks; fluoropolymer circuits; ceramic circuits; copper, brass, alloys and aluminum

Related material solutions

Epoxy conductive adhesive film
KPF-EC (silver-filled epoxy film, thickness 50 to 200 μm)

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