Application map

Bonding and Sealing

Application environment, system, component and the documented material solution behind it.

01

Electronic Adhesives and Supporting Materials

Bonding and Sealing

System / equipmentBonding and Sealing

Stated application scope

  • Electronic components; electronic and electrical equipment; electronic packaging; Type-C interfaces; LCD screens; camera modules; OA equipment and sensors; kitchen range hoods; cooktops; microwave oven glass door panels, metal frames and internal frames

Related material solutions

Electronic Adhesives and Supporting Materials - bonding and sealing
Specific model available on request (the product information lists objects such as electronic components, electronic and electrical equipment, electronic packaging, the photovoltaic industry and OA equipment, but gives no specific grades on that page)

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