Application map

Electronic Control System

Application environment, system, component and the documented material solution behind it.

02

Three-Electric Systems

Electronic Control System

System / equipmentElectronic Control System

Stated application scope

  • 1. Thermal management materials: (1) bottom thermal gap filling - thermal conductive gel; (2) thermal management - thermally conductive potting compound. 2. Epoxy materials: IGBT potting - (1) TH-850(FB); (2) PCF-6A. 3. Silicone Materials Solutions - other materials: IGBT potting; two-component addition-cure silicone gel GRESIL® R-895

Related material solutions

Thermal management materials - bottom thermal gap filling (thermal conductive gel)
Thermal conductive gel GRESIL® GMX-TG-3220 (see thermal conductive gels such as GRESIL® GMX-TG-3222 in [Thermal Management Materials])
Thermal management - thermally conductive potting compound
Thermally conductive potting compound GRESIL® GMX-8152/15N, GRESIL® GMX-8152/15N(10) (the series includes GRESIL® GMX-8152/11, GRESIL® GMX-8152/08M and others)
Epoxy materials - IGBT potting
TH-850(FB), PCF-6A
Silicone Materials Solutions - other materials (IGBT potting)
Two-component addition-cure silicone gel GRESIL® R-895
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