Thermal & adhesives

EPOXY CONDUCTIVE ADHESIVE FILM

Electronic Adhesives and Supporting Materials

Product Category	Epoxy film
Model	KPF-EC
Curing Method	Thermal curing
Product Advantages	High electrical conductivity, high thermal conductivity, uniform adhesion, strong bonding adaptability, void-free bonding, easy and clean handling, uniform heat dissipation, electrical interconnection capability, low thermal resistance
Filler Type	Silver powder
Thickness	50μm~200μm
Typical Applications	Can be used for conductive and thermally conductive bonding of circuit board materials, metal backplanes and heat sinks
Substrate	Fluoropolymer circuits, ceramic circuits, copper, brass, alloys and aluminum

Item	Properties (After Curing)
Glass Transition Temperature Tg	≥80°C
Thermal Conductivity	≥7W/m·K
Volume Resistivity	≤5×10-4Ω·cm
Shear Strength	≥10.0MPa
Coefficient of Thermal Expansion	≤70ppm/°C (below Tg); ≤180ppm/°C (above Tg)
Storage Life	6 months (-20°C)

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