Basic silicone materials
High-Strength High-Transparency Molding Silicone Rubber
HTV Silicone Rubber
HTV Silicone Rubber
High-Strength High-Transparency Molding Silicone Rubber
Features
○ Good transparency;
○ Excellent electrical insulation;
○ Good physical and mechanical properties;
○ Resistance to high and low temperatures and weathering;
Typical Applications
○ Suitable for molded and die-cast products, such as cable accessories, gaskets, washers, O-rings, diaphragms, rollers, sheets, etc.
Typical Properties
| Item | Unit | GX131-U | GX141-U | GX151-U | GX161-U | GX171-U |
|---|---|---|---|---|---|---|
| Density (25 ℃) | g/cm³ | 1.09 | 1.12 | 1.15 | 1.18 | 1.21 |
| Tensile strength | MPa≥ | 8.0 | 9.0 | 10.0 | 10.0 | 9.0 |
| Elongation at break | %≥ | 600 | 650 | 550 | 550 | 500 |
| Permanent set at break | %≤ | 4.0 | 4.0 | 4.0 | 4.0 | 4.0 |
| Tear strength | kN/m≥ | 18.0 | 22.0 | 24.0 | 24.0 | 18.0 |
| Hardness | HA | 30±2 | 40±2 | 50±2 | 60±2 | 70±3 |
| Volume resistivity | Ω·cm≥ | 1.0×10¹⁵ | 1.0×10¹⁵ | 1.0×10¹⁵ | 1.0×10¹⁵ | 1.0×10¹⁵ |
| Dielectric strength | kV/mm≥ | 20.0 | 22.0 | 22.0 | 20.0 | 20.0 |
| Relative dielectric constant (1 MHz) | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | |
| Dielectric loss factor (1 MHz) | 5.0×10⁻³ | 5.0×10⁻³ | 5.0×10⁻³ | 5.0×10⁻³ | 5.0×10⁻³ |
Instructions for Use
Add the peroxide curing agent — bis-25 — to the compound on an open mill, and after milling uniformly, it can be used for molding.
The molding process conditions should be determined according to the
specifications, shape and size of the product.
Before adding the curing agent on the open mill, various pigments can be added as needed to obtain the desired color.
After the pigment is added it should be evenly and thinly dispersed; pigment paste is preferable.
The curing agent can be added at the factory, and the product can be tinted to the color required by the customer on request.
Product inquiry
Send the model code and we will confirm the details.
Quote the series above together with the quantity, application and required material behavior.